| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve a problem that a surface mount piezoelectric transducer manufactured by a method including a process in which a solder-plated metal belt material is pressed to have a shape of a lead frame, a process in which leads of piezoelectric transducers are connected with the lead frame, a process in which the lead frame and the piezoelectric transducers are molded with resin, and a process in which the lead frame after the resin molding is cut and bent, has no solder plating on the side surfaces of the leads, and has crackings in the bent parts of the leads which causes a harmful influence upon a fixing force when the transducer is mounted on a board. SOLUTION: This manufacturing method of a surface mount piezoelectric transducer includes a process in which a solder-plated metal belt material is pressed to have a shape of a lead frame, a process in which leads of piezoelectric transducers are connected with the lead frame, a process in which the lead frame and the piezoelectric transducers are molded with resin, a process in which the lead frame after the resin molding is cut and bent, and, in addition, a process in which the surface mount piezoelectric transducers are subjected to nonelectrolytic solder plating.</p> |
