| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a TAB tape for which existing manufacturing equipment can be used without modification or alteration, and with which yield and productivity are not degraded while excellent stability in size results in manufacturing, and a semiconductor device using the same. SOLUTION: This TAB tape 11 is constituted by an insulating film 1 having an L value of 35 or larger indicating transparency, a copper foil layer 5 that forms copper wiring patterns 5A adhered to the insulating film 1, adhesives 2, 4 having a prescribed range of water absorption coefficient and of glass transition temperature, and a low-expansibility aramid tape 3 having the L value of 35 or larger and adhered to the insulating film 1 with the adhesive 4.</p> |
