METHOD FOR FIXING AND PROCESSING THIN FILM MATERIAL

摘要

PURPOSE: A method for fixing and processing a thin film material is provided to fix the thin film material used for a fabrication process using a conveyer system and process the fixed thin film. CONSTITUTION: A thin film having an adhesive pattern(12) is adhered on a carrier(11). The carrier(11) is formed with a strong material such as an optical fiber, a phenol resin structure, a glass, and a metal plate in order to endure chemical corrosion. The adhesive pattern(12) is strongly adhered on the carrier(11). The adhesive pattern(12) has a resistant characteristic to chemicals. An area of a surface of the carrier(11) is larger than an area of the thin film. The thin film is contacted with an outline portion of the surface of the carrier(11). A photoresist layer is adhered on a thin film. A developing process is performed on the photoresist layer. An edge portion of a printed circuit board(18) is smoothened by performing an etch process.