| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package in which the size and thickness can be reduced and reliability can be ensured, and a method for manufacturing the same. SOLUTION: The package includes a semiconductor chip 30 having bonding pads 30a arranged on four sides on the upper surface thereof, gold bumps 41 formed on the respective bonding pads 30a, a metallic pattern 35 consisting of inner patterns 31 connected to the bonding pads 30a on the chip 30 via the bumps 41, outer patterns 33 isolated from the inner patterns 31 and connection patterns 32 for connecting the inner and outer patterns 31 and 33, a glass substrate 40 having frame-like dams 36, a sealing member 42 for each sealing a space formed between the part on the glass substrate 40 and the part of the chip 30 and choked by the dam 36 other than the outer pattern 33 of the metallic pattern 35, and solder balls 43 on the outer patterns 33. |
