发明名称 APPARATUS AND METHOD FOR HEAT TREATMENT BY LIGHT IRRADIATION
摘要 PROBLEM TO BE SOLVED: To uniformly heat a wafer as well as to efficiently heat a guard-ring. SOLUTION: Lamps L1-L10 of a light source 1 consist of lamps L1-L8 for heating the wafer and lamps L9, L10 for heating the guard ring. The distance from the lamps L9, L10 for heating the guard ring to the guard ring 3 is larger than that from the lamps L1-L8 for heating the wafer to the wafer W. A side wall 4 between the lamps L1-L8 and the lamps L9, L10 is finished to be a mirror face, so that as to the light radiated from the lamps L9, L10 toward the wafer W is reflected toward the guard ring 3. Also a second side wall 5 is formed in the circumference of the lamps L9, L10 for heating the guard ring, making the side wall 5 a reflecting face. Furthermore, in the circumference of the guard ring 3, a second mirror 6 is provided, to concentrate the light radiated on the outer side of the guard ring 3, to the guard ring 3.
申请公布号 JP2002118071(A) 申请公布日期 2002.04.19
申请号 JP20000309024 申请日期 2000.10.10
申请人 USHIO INC 发明人 SUZUKI SHINJI;MIMURA YOSHIKI
分类号 F27D11/02;H01L21/00;H01L21/205;H01L21/26;(IPC1-7):H01L21/26 主分类号 F27D11/02
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