A DIGITAL INTEGRATED CIRCUIT PACKAGE EMPLOYING I/O BGA (BALL GRID ARRAY) FORMAT, AND A SINGLE CERAMIC SUBSTRATE LAYER WITH BIMETALLIC TECHNOLOGY OF FILLED PATH.

摘要

It is disclosed a package or encapsulate of integrated circuit which exhibits a high performance and a great capacity of input/output (I/O) while maintaining a small printed circuit. The package employs a ball grid array format (BGA) and a single layer ceramic substrate with bimetallic filled paths accurately placed.