| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where a lead terminal section has length (area) required for external connection, at the same time, the insulation reliability between suspension lead and lead terminal sections is secured, size in a plane direction is small, and packaging area is also small, and a lead frame used for the semiconductor device. SOLUTION: This lead frame has a frame section, a support section 4 arranged at the center of the frame section, a suspension lead section 3 for connecting the corner of the frame section to the support section 4, and a lead terminal section 5 extended from the side of the frame section in a semiconductor device manufacture unit. A lead terminal section 5A adjacent to the suspension lead section 3 has a beveling section nearly along the suspension lead section 3 at the tip to avoid interference with the suspension lead section 3. |
