| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding head and a bonding apparatus provided therewith, which can surely bond a bonding object and a member to be bonded, and with which miniaturization of the whole body of the apparatus is possible. SOLUTION: This bonding head comprises a vibrator 2, a vibration transferring member 1 which is coupled to the vibrator 2 to transfer the ultrasonic vibration from the vibrator 2 to the bonding object, supporting members 3 (a first supporting member 3a and a second supporting member 3b) that support and fix the vibration transferring member 1, a compressing member 4 that compresses the bonding object to apply the ultrasonic vibration to the bonding object and to the member to be bonded to bond the both, and a set of heating mechanism 30, a cooling mechanism 40, and a controller 50, which control the temperature at an optimum temperature. |
