| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device incorporating a semiconductor element for use especially at high frequencies stored in an airtight hollow package which can be checked for a defective adhesion by visual inspection, and also provide a method of manufacturing the same. SOLUTION: A first principal plane 22a is provided on the surface side of a substrate 21a. On the first principal plane 22a, as island section 26 is formed and a semiconductor chip 29 or the like is fixed to it. The semiconductor chip 29 or the like is sealed in a hollow part formed by a columnar section 23 and a transparent glass board 36. The columnar section 23 and the glass board 36 are bonded to each other by epoxy resin or the like. By using the glass board, a bad adhesion generated during the bonding process can be found by visual inspection. |
