| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing device and a curing method by which the contamination of the surface of a semiconductor chip by volatile constituents of the resin, especially by the silver paste vapor can be prevented without causing displacement between the semiconductor chip and its package and contamination in the clean room. SOLUTION: The curing device has a curing furnace in the inner space of which a package 10 to which a semiconductor device is bonded through resin is housed, an opening and closing member 6 which is provided in the curing furnace and can be in the open state for carrying the package in and out and in the closed state for cutting the inner space off from the surroundings, a heating means 4 which heats the package for causing reaction and curing of the resin, air supplying means 13, 14 and 15 which supply air to the inner space through an air supply opening 12 and generate an air flow in the inner space and exhaust means 17 and 18 which exhaust gas containing the volatile constituents of the resin from the inner space through the exhaust opening 16.
|
