METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a tape carrier package(TCP) technique by which bend of inner leads can be prevented and insufficient wraparound of resin on the mounting surface of semiconductor chips can be prevented. SOLUTION: A semiconductor chip 5 is mounted on a tape 1 which has a supporting film 1a, inner leads 2 formed on the supporting film 1a, solder resist 3 formed in the chip mounting region on the supporting film 1a and around the chip sealing region around it and dams 4 formed on the solder resist in such a way that bump electrodes 5a are positioned on the inner leads 2. Underfill material 6 is supplied between the underside of the semiconductor chip 5 and the supporting film 1a, and between the sides of the semiconductor chip 5 and the dams 4 by discharging the underfill material 6 from the mounting side of the semiconductor chip 5 onto the chip sealing region.