发明名称 RADIATOR OF ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE RADIATOR
摘要 PROBLEM TO BE SOLVED: To reduce the number of component parts in the radiator of an electronic component, and to simplify structure for reducing manufacturing costs. SOLUTION: The radiator of the electronic component comprises a cooling fin 12 where a number of fins 11 are formed on the upper surface of a metallic plane plate section 10 at specific intervals, and a metallic base plate 16 where a plurality of bottom-expanded recesses 15 are formed on the upper surface of a plane section 14 at specific intervals. In the radiator, a portion at the plane plate section 10 between the fins 11 corresponding to the bottom-expanded recess 15 is pressed by a press die 18, a projection 13 formed on the rear of the plane plate section 10 is forced and fitted into the bottom-expanded recess 15, and the cooling fin 12 and the base plate 16 are assembled for fixation.
申请公布号 JP2002118211(A) 申请公布日期 2002.04.19
申请号 JP20000311437 申请日期 2000.10.12
申请人 MIZUTANI DENKI KOGYO KK 发明人 MIZUTANI KAZUO
分类号 H01L23/36;H01L21/48;(IPC1-7):H01L23/36 主分类号 H01L23/36
代理机构 代理人
主权项
地址