| 摘要 |
PURPOSE: A tape for chip on film and a semiconductor therewith are provided to be capable of preventing air bubbles from being generated during resin sealing of a semiconductor element and capable of decreasing disconnection of an inner lead located at a corner of the semiconductor element. CONSTITUTION: A dummy pattern(19) for preventing generation of air bubbles in resin sealing of a semiconductor element(14) is provided at a corner of the semiconductor element(14) on a tape carrier which is composed of a polyimide-based insulating tape and a copper foil pattern(14) formed thereon. The dummy pattern(19) makes it possible to control flow of sealing resin(18) from the corner of the semiconductor element(14) to a space between a lower surface of the semiconductor element and the insulating tape, resulting in prevention of air bubbles generated in resin sealing of the semiconductor element. A generation rate of air bubble can be decreased to 50% or less as compared with a conventional COF semiconductor device. |
