| 摘要 |
PROBLEM TO BE SOLVED: To improve the cooling performance of electrical heating elements such as a CPU mounted onto an electronic substrate. SOLUTION: This electronic cooling device has the electronic substrate 1 having the electrical heating element 2, a heat conduction block 5 where top and bottom surfaces are provided, and sectional area becomes gradually larger from the top toward the bottom surface, and the top surface is in contact with the electrical heating element, an electronic cooling element 7 provided on the bottom surface of the heat conduction block 5, a radiator 10 provided at the radiation side of the electronic cooling element, and a fixing member 11 having an opening 11a. In this case, the opening 11a of the fixing member 11 is brought into contact with a slant 5a of the heat conduction block or a ridge 5b, the fixing member 11 and radiator 10 are fixed, and at the same time the fixing member 11 and the electronic substrate 1 are fixed. |
