| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electrostatic chuck, a semiconductor processing system and a separating method of electrostatic chuck where the work for removing an article to be processed from a mounting table can be simplified. SOLUTION: The electrostatic chuck attracts a wafer 1 to a table 2 by a Coulomb force generated between the table and the wafer by applying a voltage between them. The electrostatic chuck comprises a DC power supply 4 for applying a voltage between the central part 11 and the outer circumferential part 12 of the table when the wafer 1 is attracted to the table 2, an AC power supply 5 for applying a voltage between the central part 11 and the outer circumferential part 12 of the table when the wafer 1 is separated from the table 2, and a control section 7 for attenuating and oscillating the voltage being applied from the AC power supply.</p> |
