| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board together with its manufacturing method where the loop inductance is reduced. SOLUTION: First, second, and third resin substrates 30a, 30b, and 30c are laminated to form a core substrate 30 in which a chip capacitor 20 is provided. Thus, the loop inductance is reduced. Since an opening 38 is opened with laser using an opening 32a of a copper foil 32 of the core substrate 30 as a conformal mask, a via hole 50 is appropriately connected to the chip capacitor 20.</p> |
