发明名称 METHOD FOR MANUFACTURING TRANSPARENT LAMINATE
摘要 PROBLEM TO BE SOLVED: To manufacture at high productivity a transparent laminate with high quality such as high transparency or high conductivity by forming at high speed a metal oxide thin layer with a sputtering method without oxidizing a silver base transparent conductor thin layer which is a substrate when the metal oxide thin layer is laminated as a transparent thin layer on the silver base transparent conductor thin film. SOLUTION: This transparent laminate is manufactured by repeatedly laminating a combination of the silver base transparent conductor thin layer having a thickness of 1-30 nm and the transparent thin layer having a thickness of 10-300 nm, and using the metal oxide thin layer in at least one of the transparent thin layers laminated on the silver base transparent conductor thin layer. When the metal oxide thin layer is formed with the sputtering method, the sputtering using a metal oxide target is conducted, and then reactive sputtering using a metal target is conducted.
申请公布号 JP2002117735(A) 申请公布日期 2002.04.19
申请号 JP20000309858 申请日期 2000.10.10
申请人 NITTO DENKO CORP 发明人 NAKAMURA TOSHITAKA;SASA KAZUAKI;HIEDA YOSHIHIRO;MIYAUCHI KAZUHIKO;AZUMI YUKIKO
分类号 C23C14/08;C23C14/34;H01B5/14;H01B13/00;(IPC1-7):H01B13/00 主分类号 C23C14/08
代理机构 代理人
主权项
地址