COMPOSITION FOR PRODUCING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a new composition for forming a uniformly etched and conversion-coated surface having desired characteristics for the lamination of a circuit layer and a liquid polymer coating by treating copper and the alloy in the production of a multilayer circuit. SOLUTION: The adhesion promoting composition contains (1) hydrogen peroxide, (2) inorganic acid and (3) at least two kinds of corrosion preventives, and the corrosion preventives contain at least one kind of hydroxy-substituted azole compound.