| 摘要 |
A bonding pad structure with a bonding pad with a circular shape or an elliptical shape. The circular or the elliptical bonding pad structure does not have any sharp angularity. It improves the stress concentration problem which results from the abrupt shrinkage of the cross section of the protective layer. The circular or the elliptical shape of the bonding pad structure can also prevent the abrupt shrinkage of the cross section of the protective layer due to the gradual change of angularity. Therefore, this kind of shape can disperse the stress and prevent the abruption on the protective layer after the bonding wire and packaging produces.
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