发明名称 |
Leadframe for chips, having low resistance connections |
摘要 |
A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for mutual connection, by connecting wires connecting the leads and the semiconductor device. The leads include leads having at least two different lengths for the connection of connecting wires having different diameters. |
申请公布号 |
US2002043701(A1) |
申请公布日期 |
2002.04.18 |
申请号 |
US20010862214 |
申请日期 |
2001.05.21 |
申请人 |
TIZIANI ROBERTO;COGNETTI CARLO;CIGADA ANDREA |
发明人 |
TIZIANI ROBERTO;COGNETTI CARLO;CIGADA ANDREA |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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