发明名称 PROCESSING APPARATUS AND CLEANING METHOD
摘要 In a chamber (11), a SiOF film is formed on a wafer W using a plasma CVD method. A film remaining inside the chamber (11) is cleaned up using a gas containing NF3. A manometer (28) is prepared for the chamber (11). An end point of cleaning of the chamber (11) is detected by monitoring the pressure inside the chamber (11).
申请公布号 WO0212585(A3) 申请公布日期 2002.04.18
申请号 WO2001JP06785 申请日期 2001.08.07
申请人 TOKYO ELECTRON LIMITED;FUKIAGE, NORIAKI 发明人 FUKIAGE, NORIAKI
分类号 B08B7/00;C23C16/44;C23F4/00;H01L21/302;H01L21/3065;H01L21/31 主分类号 B08B7/00
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