The present invention provides a resist ink composition comprising a compound (a) having at least one oxetanyl group and at least one epoxy group within the same molecule and a compound (b) capable of initiating cationic polymerization under irradiation by an active energy ray and/or under heat. This resist ink composition has high photosensitivity and enables the final curing by a brief heating and the cured film exhibits good physical properties.
申请公布号
WO0208347(A3)
申请公布日期
2002.04.18
申请号
WO2001JP06309
申请日期
2001.07.19
申请人
SHOWA DENKO K. K.;WATANABE, TAKEO;SATO, TAKASHI;TAGOSHI, HIROTAKA