发明名称 SEMICONDUCTOR AMORPHOUS LAYER FORMED WITH ENERGY BEAM
摘要 High quality epitaxial layers of compound semiconductor materials (26) can be grown overlying large silicon wafers (22) by first growing an accommodating buffer layer (24) on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide (28). The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. To further relieve strain in the accommodating buffer layer, at least a portion of the accommodating buffer layer is exposed to a high energy beam anneal process to cause the accommodating buffer layer to become amorphous, providing a true compliant substrate for subsequent layer growth.
申请公布号 WO0231872(A1) 申请公布日期 2002.04.18
申请号 WO2001US29412 申请日期 2001.09.20
申请人 MOTOROLA, INC. 发明人 EISENBEISER, KURT
分类号 H01L21/20;H01L21/263;H01L21/3105 主分类号 H01L21/20
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