Verfahren und Gerät für das Verbinden von Leiterplatten, Tintenstrahldruckkopf und Aufzeichnungsgerät

摘要

A wiring board connecting method of electrically connecting a plurality of first wiring boards juxtaposed side by side each having terminals at one end, to a second common wiring board having a plurality of terminal groups to be connected to the terminals of the first wiring boards. The method includes the steps of providing a first position alignment mark at each side area of each of the first wiring boards and a second position alignment mark at each area between adjacent terminal groups of the second wiring board, after the first and second wiring boards are superposed to make the areas provided with the first and second position alignment marks face one another, aligning the first wiring boards with the second wiring board so as to make the largest gap between the first and second position alignment marks as small as possible, and electrically connecting the first wiring boards to the second wiring board.