SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor device is provided to effectively connect between an SOI region for an embedded logic device and a bulk region for an embedded memory device. CONSTITUTION: The semiconductor device comprises a single crystalline substrate having a substantially planar surface, a first surface area on the planar surface having a semiconductor-on-insulator region(26), and a second surface area on the planar surface being a single crystalline bulk region(12). Embedded logic devices(82) are formed in the silicon-on-insulator region(26). Also, embedded memory devices are formed in the single crystalline bulk region(12). Preferably, the single crystalline substrate is a silicon wafer.