| 摘要 |
An apparatus for temporarily attaching an integrated circuit chip to a chip carrier for subsequent electrical testing of the integrated circuit chip is provided consisting of a support carrier and a compression adjusting device to apply a compressive force via the support carrier to the integrated circuit chip to be tested, whereby the support carrier is arranged between the compression adjusting device and the integrated circuit chip to be tested, as well as a method for temporarily attaching an integrated circuit chip to a chip carrier. Furthermore, the support carrier is adapted to function as a transport vehicle for the integrated circuit chip.
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