发明名称 |
Electronic subassembly e.g. for SMD-components, has metal bridges/webs embedded in electrically-insulating material of assembly board |
摘要 |
An electronic subassembly has an assembly plate (circuit board) (4) with electronic components (1-3), in which the assembly board (4) has metallic bridges (41) embedded in an electrically insulating material. The metal bridges (41) have a first face (411) as a contract surface for contacting the electronic components (1-3). Recesses (5) are arranged in the electrically-insulating material (40), via which the second side (412) of each of the metal bridges (41) is available for a voltage- or current- measurement device.
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申请公布号 |
DE10047897(A1) |
申请公布日期 |
2002.04.18 |
申请号 |
DE2000147897 |
申请日期 |
2000.09.26 |
申请人 |
PATENT-TREUHAND-GESELLSCHAFT FUER ELEKTRISCHE GLUEHLAMPEN MBH |
发明人 |
BURKHARDT, MATTHIAS |
分类号 |
H01L23/538;H05B41/02;H05B41/282;H05K1/02;H05K3/20;(IPC1-7):H01L23/12;H01L25/11;H05K7/02 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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