发明名称 |
Batch-type heat treatment apparatus and control method for the batch-type heat treatment apparatus |
摘要 |
A heat treatment apparatus for making a heat treatment while estimating temperatures of objects-to-be-processed can estimate correct temperatures of the objects-to-be-processed. A reaction tube 2 comprises heaters 31-35, and temperature sensors Sin1-Sin5, Sout1-Sout5, and receives a wafer boat 23. A controller 100 estimates temperatures of wafers W and temperatures of the temperature sensors Sin1-Sin5 in 5 zones in the reaction tube 2 corresponding to the heaters 31-35 by using the temperature sensors Sin1-Sin5, Sout1-Sout5 and electric powers of the heaters 31-35. Based on relationships between estimated temperatures of the temperature sensors Sin1-Sin5 and really metered temperatures, functions f1-f5 expressing the relationships between the estimated temperatures and the really metered temperatures are given for the respective zones. The functions f1-f5 are substituted by the estimated wafer temperatures to correct the estimated wafer temperatures. Electric powers to be fed to the respective heaters 31-35 are respectively controlled so that the corrected wafer temperatures are converged to target temperature trajectories.
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申请公布号 |
US2002045146(A1) |
申请公布日期 |
2002.04.18 |
申请号 |
US20010950876 |
申请日期 |
2001.09.13 |
申请人 |
WANG WENLING;SAKAMOTO KOICHI;SUZUKI FUJIO;YASUHARA MOYURU |
发明人 |
WANG WENLING;SAKAMOTO KOICHI;SUZUKI FUJIO;YASUHARA MOYURU |
分类号 |
H01L21/324;C23C16/46;C23C16/52;C30B31/18;F27B5/18;F27D19/00;F27D21/00;G05D23/19;H01L21/00;H01L21/205;H01L21/22;(IPC1-7):F27D19/00 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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