EQUIPMENT FOR ENCAPSULATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: Equipment for encapsulating a semiconductor device is provided to control the height of encapsulant supplied by a potting method, by supplying wind through a ventilation unit. CONSTITUTION: A supplying unit(102) supplies the semiconductor device where an encapsulation process is performed. The encapsulation process is performed on a work table(108) regarding the semiconductor device supplied from the supplying unit, adjacent to the supplying unit. A dispenser(114) supplies encapsulant to the semiconductor device, positioned on the work table. The ventilation unit(116) applies wind of a predetermined pressure to the semiconductor device to which the encapsulant is supplied. The semiconductor device after the encapsulation process is loaded to a stack unit(104).