| 摘要 |
A chemical mechanical planarization system and method for planarizing wafers is provided. The system generally includes a transfer corridor (104), at least one corridor robot (138,140), one or more polishing modules (106a,106b) and at least one loading device (12). The corridor robot (138,140) is disposed in the transfer corridor (104) and is positionable between a first end (122) and a second end (124) of the transfer corridor (104). The loading device (112) is adapted to transfer workpieces between the transfer corridor (104) and the polishing modules (106a,106b). Generally, the loading device (112) includes at least one load cup (166). The one or more polishing modules (106a,106b) each include one or more polishing heads (164) for holding workpieces during processing.
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