| 摘要 |
A COF-use tape carrier for a semiconductor device has dummy leads not to be electrically connected to a semiconductor chip, in the proximity of an edge of an opening of a solder resist. The dummy leads are provided on an insulating tape, between adjacent two inner leads that are relatively widely spaced from each other. The dummy leads extend across the edge of the opening of the solder resist, so that one end of each dummy lead is located within the opening of the solder resist, while the other end of the dummy lead is located under the solder resist. A semiconductor chip is to be mounted on a chip-mounting region of the insulating tape.
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