发明名称 PACKAGING MATERIAL FOR ELECTRONIC-PART CASE, AND OTHERS
摘要 <p>A packaging material for electronic-part cases which is excellent in processability and strength, has high aluminum foil/resin layer adhesion, is excellent in water vapor impermeability and heat sealability, and is not attacked by electrolytic solutions, etc.; an electronic-part case which is obtained with the packaging material; and an electronic part, etc. packaged in the case. The packaging material comprises a stretched film layer of a heat-resistant resin as an outer-side layer, an unstretched film layer of a thermoplastic resin as an inner-side layer, and an aluminum foil layer disposed therebetween, and is characterized by having an acrylic polymer layer disposed between the aluminum layer and the unstretched film layer.</p>
申请公布号 WO2002031898(P1) 申请公布日期 2002.04.18
申请号 JP2001008974 申请日期 2001.10.12
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