SEMICONDUCTOR PRODUCTION DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

摘要

A semiconductor production device for carrying out by one production device a plurality of processes including a plating process, an annealing process and two CMP processes to thereby shorten a TAT, and for replacing CMP processes with other processes to thereby reduce costs of expendables, the device comprising an electroplating chamber (11) for electroplating a substrate (91), an electrolytic polishing chamber (21) for electrolytic-polishing the substrate, a carrying device (83) for carrying the substrate into/out of the electroplating chamber and the electrolytic polishing chamber, and a carrying chamber (81) connected to the electroplating chamber and the electrolytic polishing chamber respectively, the carrying chamber being able to be connected with an electoless plating chamber, an annealing chamber, a liquid treating chamber, etc.