发明名称 Substrate cleaning apparatus and substrate polishing apparatus with substrate cleaning apparatus
摘要 A substrate cleaning apparatus is provided which comprises a box in which a substrate is cleaned with a cleaning liquid, and an exhaust system for exhausting the box, wherein the box is provided in its upper wall with an air intake opening and the exhaust system is fluidly connected to the box at a lower wall of the box so that air is introduced into the box through the air intake opening, flows down in the box passing around the substrate and finally exit the box through the exhaust system. A door is provided to close the air intake opening when an inside air pressure in the box becomes greater than an outside air pressure outside the box.
申请公布号 US2002045413(A1) 申请公布日期 2002.04.18
申请号 US20010915289 申请日期 2001.07.27
申请人 SOTOZAKI HIROSHI 发明人 SOTOZAKI HIROSHI
分类号 B24B37/04;H01L21/00;(IPC1-7):B24B7/00 主分类号 B24B37/04
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