发明名称 |
Semiconductor device and assembly board |
摘要 |
A semiconductor device includes a board base having through-holes filled with a filling core , an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer , and nodes provided on a lower surface of the board base , wherein the one or more paths are laid out without a restriction posed by the through-holes , and are used for electrically connecting the semiconductor chip and the nodes. |
申请公布号 |
EP1198000(A1) |
申请公布日期 |
2002.04.17 |
申请号 |
EP20010129844 |
申请日期 |
1995.04.13 |
申请人 |
FUJITSU LIMITED |
发明人 |
IIJIMA, MAKOTO;WAKABAYASHI, TETSUSHI;HAMANO, TOSHIO;MINAMIZAWA, MASAHARU;TAKENAKA, MASASHI;YAMASHITA, TATUROU;MIZUKOSHI, MASATAKA |
分类号 |
H01L23/12;H01L21/48;H01L21/60;H01L23/10;H01L23/14;H01L23/24;H01L23/31;H01L23/498;H01L25/065;H01L25/18;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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