发明名称 PRODUCTION PROCESS OF CURVED LAYERED MOLDING BOARD WITH DIFFERENT THICKNESS AND CURVED LAYERED MOLDING BOARD THEREOF
摘要 PURPOSE: Provided is a production process of a curved layered molding board with different thickness which uses different length among layered boards to pile up for forming curved surface so that it improves design of products due to different thickness. CONSTITUTION: The production process of the curved layered molding board with different thickness is characterized by laying a second layered plate(2) shorter than the base layered plate on a base layered plate(1), laying a third layered plate(3) shorter than the base layered plate on a second layered plate, laying the layered plate sequentially as above, inserting the layered plate into gap between heating plates and adding heat and pressure to produce the wanted product wherein the interval between the layered plates is kept the same and both edges(10a, 10b) at the complete board are different in thickness and treated in curved surface.
申请公布号 KR20020029027(A) 申请公布日期 2002.04.17
申请号 KR20020016096 申请日期 2002.03.25
申请人 KOO, DUK SOON 发明人 KOO, DUK SOON
分类号 B27D3/00;(IPC1-7):B27D3/00 主分类号 B27D3/00
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