发明名称 |
Method of testing and mounting devices using a resilient contact structure |
摘要 |
A method of connecting to a semiconductor device comprises the steps of permanently mounting a plurality of elongate electrical contact structures (1330) to a semiconductor device (1302), the semiconductor device comprising at least one die; urging the semiconductor device against a first electronic component (1310) to effect a temporary connection between the semiconductor device and the first electronic component, with the electrical contact structures serving as electrical interconnects between the semiconductor device and the first electronic component; and using at least a plurality of the same electrical contact structures mounted to the semiconductor device to effect a permanent connection between at least one die of the semiconductor device and a second electronic component. |
申请公布号 |
EP1198001(A2) |
申请公布日期 |
2002.04.17 |
申请号 |
EP20010127397 |
申请日期 |
1995.11.13 |
申请人 |
FORMFACTOR, INC. |
发明人 |
KHANDROS, IGOR Y.;MATHIEU, GAETAN;ELDRIDGE, BENJAMIN N.;GRUBE, GARY W. |
分类号 |
G01R1/073;H01L21/66;B23K1/00;B23K20/00;B23K31/02;C23C18/16;C25D5/08;C25D5/16;C25D5/22;C25D7/12;C25D21/02;G01R1/04;G01R1/06;G01R1/067;G01R31/26;G01R31/28;H01L21/00;H01L21/48;H01L21/56;H01L21/58;H01L21/60;H01L21/603;H01L21/607;H01L21/68;H01L23/02;H01L23/12;H01L23/32;H01L23/48;H01L23/485;H01L23/49;H01L23/498;H01L23/538;H01L25/065;H01L25/07;H01L25/16;H01L25/18;H01R9/00;H01R12/71;H01R13/05;H01R13/24;H01R29/00;H01R33/74;H01R33/76;H01R107/00;H05H1/18;H05K1/14;H05K1/18;H05K3/20;H05K3/24;H05K3/30;H05K3/32;H05K3/34;H05K3/36;H05K3/40;H05K7/10 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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