发明名称 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE |
摘要 |
A method of manufacturing a semiconductor device comprising a step of forming a plurality of resin layers, an interconnect connected electrically to an electrode of each of a plurality of semiconductor elements, and an external terminal connected electrically to the interconnect, on an aggregate of semiconductor elements having an electrode, and a step of cutting the aggregate, wherein at least one resin layer among the plurality of resin layers is formed avoiding a cutting region of the aggregate. |
申请公布号 |
EP1198003(A1) |
申请公布日期 |
2002.04.17 |
申请号 |
EP20010915722 |
申请日期 |
2001.03.23 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KUWABARA, KEIJI;HANAOKA, TERUNAO;ITO, HARUKI |
分类号 |
H01L21/56;H01L21/78;H01L23/00;H01L23/31;H01L23/485 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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