发明名称 |
Method of fabricating a III-V compound semiconductor device with an Aluminium-compound layer |
摘要 |
<p>Disclosed is a method of fabricating a compound semiconductor device, which has an Al-based compound semiconductor layer and is suitable for producing, for example, a semiconductor laser device with a buried structure. The method comprises a first step of sequentially performing vapor growth of a plurality of compound semiconductor layers including an Al-based compound semiconductor layer formed on a semiconductor substrate by using a metalorganic chemical vapor deposition (MOCVD), thereby forming a semiconductor multilayer (epitaxial layer) having, for example, a double heterostructure; a second step of selectively etching a specific compound semiconductor layer in the semiconductor multilayer other than the Al-based compound semiconductor layer in the MOCVD using a bromine-based gas, thereby forming a mesa; and a third step of regrowing a predetermined compound semiconductor layer on the semiconductor multilayer in the MOCVD following the etching step. <IMAGE> <IMAGE> <IMAGE></p> |
申请公布号 |
EP1198043(A2) |
申请公布日期 |
2002.04.17 |
申请号 |
EP20010123215 |
申请日期 |
2001.10.01 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
ARAKAWA, SATOSHI;KASUKAWA, AKIHIKO |
分类号 |
H01L21/302;B82Y10/00;B82Y20/00;B82Y40/00;H01L21/20;H01L21/205;H01L21/3065;H01S5/20;H01S5/223;H01S5/227;(IPC1-7):H01S5/22;H01L21/306;H01L33/00 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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