| 摘要 |
The present invention provides compositions containing a resin component comprising compound (A) wherein all or a part of oxirane ring in an epoxy compound is replaced with thiirane ring, or the compound (A) and compound (B) which contains oxirane ring and no thiirane ring in the molecule. The compositions provided are a resin composition exhibiting sufficient adhesive strength and fast curing properties, or the composition further exhibiting good balance between pot life and low temperature curability as well as high flexibility and reduced odor; a resin composition for sealant exhibiting improved adhesion and tensile strength; a resin composition for a coating composition and a coating agent exhibiting sufficient curability, good adhesion to the substrate, and reduced odor without detracting from the sufficient pot life; a resin composition for electric applications suitable for use as a potting resin of printed circuit boards and a resin for impregnation in prepregs which develops insulation in a short period, and which exhibits flame retardancy, excellent curability, and good adhesion to metals; a resin composition exhibiting excellent fast curing properties, and in particular, excellent fast curing properties at a low temperature as well as high storage stability at a high temperature; a resin composition suitable for adhesives and the like containing a phosphite ester compounds of particular type and exhibiting excellent adhesion, curability at low a temperature, reduced odor, and sufficient storage stability; a fast curing, one part resin composition suitable for use as a coating composition, an adhesive and the like containing a ketimine of particular type and exhibiting low temperature curability and storage stability; and a resin composition free from the clouding of the thiirane-containing resin by crystallization having incorporated therein a reactive diluent capable of reducing the viscosity of the composition. |
