| 摘要 |
PURPOSE: An assembly structure of a semiconductor image sensor is provided to be mounted in small electronic appliances like a personal computer(PC) camera and a mobile phone, by using only a glass substrate, a chip-size semiconductor image sensor and a conductive ball without using a lead frame, a conductive wire and a printed circuit board. CONSTITUTION: A pad(33) is formed on the upper surface of the semiconductor image sensor(32). An elastomer layer is formed on the semiconductor image sensor. The first conductive ball(34) is attached to the upper surface of the pad. A conductive interconnection circuit(31) is formed on a surface of the glass substrate(30). A part of the conductive interconnection circuit is connected to the first conductive ball. The glass substrate is installed on the semiconductor image sensor. The second conductive ball(35) is connected to another part of the conductive interconnection circuit formed on the glass substrate.
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