STRUCTURE OF LEAD FRAME FOR SEMICONDUCTOR PACKAGE PROCESS

摘要

PURPOSE: A structure of a lead frame for a semiconductor package process is provided to prevent a package defect caused by a burr, by maintaining a sufficient insulation interval between leads even when the burr is generated at both side edges of the lead by plating remnants. CONSTITUTION: A semiconductor chip is settled in a die pad. A plurality of inner leads are disposed near the die pad. An outer lead(3) is extended from the respective inner leads to the outside. A burr escaping groove(10) having a predetermined depth and width is formed at both side edges of the upper surface of the outer lead.