SUBSTRATE MOUNT TAPE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A substrate mount tape for semiconductor package and a method for fabricating the same are provided to prevent the pollution due to a sealant coated on a whole surface of substrate. CONSTITUTION: A mounted tape(2) is adhered on a predetermined face of a carrier frame(11). The mounted tape(2) has a width enough to cover the carrier frame(11). A predetermined window is formed on the mounted tape(2) by using a shape forming tool. The predetermined window of the mounted tape(2) includes a projection portion(22), a corner(23), an anti-pollution notch(24). A tape window(21) is formed on a corresponding position of the carrier frame(11). A size of the tape window(21) is similar to a size of a window of the carrier frame(11). The projection portion(22) is formed on an edge of the mounted tape(2). The triangular corner(23) is formed in a corner of the mounted tape(2).