发明名称 |
Copper foil bonding treatment with improved bond strength and resistance to undercutting |
摘要 |
<p>A treated electrodeposited copper foil having a bond-enhancing copper layer, preferably a plurality of layers, electrodeposited on a bonding side of a base copper foil, a layer of co-deposited copper and arsenic electrodeposited on the bond-enhancing layer, and a zinc or zinc alloy layer electrodeposited on the copper/arsenic layer. A process for making such foil, and a copper-clad laminate wherein such foil is bonded to a polymeric substrate. <IMAGE></p> |
申请公布号 |
EP1089603(A3) |
申请公布日期 |
2002.04.17 |
申请号 |
EP20000610100 |
申请日期 |
2000.09.28 |
申请人 |
YATES FOIL USA, INC. |
发明人 |
GASKILL, GEORGE;CHENG, CHINSAI T.;SHAH, AJESH;YATES, CHARLES B. |
分类号 |
H05K1/09;B32B15/08;C25D3/58;C25D7/06;H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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