METHOD FOR TESTING PACKAGE IN BALL-GRID-ARRAY PACKAGE MOLDING PROCESS AND MOLDING APPARATUS THEREFOR

摘要

PURPOSE: A method for testing a package in a ball-grid-array(BGA) package molding process is provided to simultaneously perform an electrical test regarding a BGA package while performing a molding process, by improving the structure of a BGA package molding apparatus. CONSTITUTION: A circuit board(3) for fabricating the wire-bonded BGA package of a strip state is settled on a lower mold die(2). The lower mold die and an upper mold die(1) are combined. Molding compound is injected into a cavity made by the combination of the upper mold die and the lower mold die. Power is applied to the molded semiconductor device through a solder ball land of the circuit board within a predetermined interval of time. Whether the semiconductor device and the circuit board operate in a normal state is detected.