| 摘要 |
PURPOSE: A non-contact type IC card module producing system and method is provided to apply supersonic wave indirectly to a copper wire antenna wound on a base plate for fixing the copper wire antenna to the base plate at once and simplifying an electrical connection between the antenna and a chip. CONSTITUTION: The system comprises a work table(30), a jig(32), an absorption member(34), a buffering spring(36), an absorption hole(38), an insert cartridge(40), and a wire winder(50). The work table(30), rotatable, has a circular shape and installs four jigs(32) on an upper surface for fixing a base plate of an IC card module. The jig(32) includes an absorption member(34) with a certain height protruded from a center. The absorption member(34) is liftable up and down up to a certain height by the buffering spring(36). The height of the absorption member(34), when lifted up by the buffering spring(36), is the same as that of copper wire, when it is fixedly molten at the base plate. The absorption hole(38) is formed at the center of the absorption member(34) for fixing the base plate, and connected to a vacuum passage(39) formed along the work table(30) for supplying vacuum pressure. The insert cartridge(40), installed at a side of the work table(30), feeds the base plate for the jig(32) one by one. The wire winder(50), installed equidistantly between the jigs(32), winds the copper wire on the base plate.
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