COMPOUND SEMICONDUCTOR DEVICE

摘要

PURPOSE: Compound semiconductor devices for use at frequencies of about 2.4 GHz and higher is provided to have a significantly smaller chip size than conventional devices while maintaining low insertion loss and high isolation. CONSTITUTION: A compound semiconductor device comprises a substrate made of a compound semiconductor; a connecting pad which is formed directly on the substrate and is used for connecting to a bonding wire; and an activated impurity region which is formed underneath the connecting pad and prevents a depletion layer from expanding beyond the impurity region.