| 摘要 |
PURPOSE: An apparatus for attaching a micro ball-grid-array(BGA) solder balls is provided to reduce failure of the integrated circuit board. CONSTITUTION: The apparatus includes a conveyer(10) for carrying a circuit board(2), a flux coater(100) coupled to the first transporter(114) for coating a flux onto the circuit board, and a solder ball attaching unit(200) coupled to the second transporter(208) for attaching solder balls to the fluxed circuit board. The apparatus further includes a discharger(400) for discharging the solder ball attached circuit board and an adjustment device(300) for adjusting the position of the circuit board. The position adjustment device(300) includes an X-axis adjustment device(310) having driving mechanism which adjusts position of the circuit board along the movement of the conveyer(10) by a control signal of a controller. A sensing device(302) is provided at the conveyer(10) to sense the position of the circuit board. The sensing device(302) is connected to the controller, which allows the flux coater(100) and the attaching unit(200) to be moved along a Y-axis which is perpendicular to the moving direction of the conveyer(10).
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