| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the visibility of a laser beam marking. SOLUTION: The method for laser beam marking, by which the marking on the surface of a semiconductor package 1 is performed by irradiating the surface of the semiconductor package 1 with a laser beam, is composed of a process where a white or light-colored coating 3 is formed on the surface of the semiconductor package 1, a process where a blank or thick-colored coating 4 is formed on the white or light-colored coating 3, and a process where a desired part of the coating 4 is removed by irradiating the black or thick- colored coating 4 with the laser beam and the white or light-colored coating 3 existing as an under-layer of the black or thick-colored coating 4 is exposed, thus a marking on the semiconductor package 1 is performed.</p> |
