发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment device, which removes a foreign matter adhered to a substrate W by jetting a liquid, capable of enhancing efficiency of the removal treatment of the foreign mater. SOLUTION: The substrate treatment device is provided with an upstream spray nozzle 21a, 21b, a midstream spray nozzle 22a, 22b and a downstream spray nozzle 23a, 23b. The particle size of pure water L2 jetted from the midstream spray nozzle 22a, 22b is smaller than that of pure water L1 jetted from the upstream spray nozzle 21a, 21b and the particle size of pure water L3 jetted from the downstream spray nozzle 23a, 23b is further smaller than that of the pure water L2 jetted from the midstream spray nozzle 22a, 22b.
申请公布号 JP2002113430(A) 申请公布日期 2002.04.16
申请号 JP20000310543 申请日期 2000.10.11
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 YOSHITANI MITSUAKI
分类号 G02F1/13;B08B3/02;G02F1/1333;H01L21/304;H05K3/00;H05K3/26;(IPC1-7):B08B3/02;G02F1/133 主分类号 G02F1/13
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